? semiconductor components industries, llc, 2002 january, 2002 rev. 0 1 publication order number: mbr3060/d mbr3060 axial lead rectifier . . . employing the schottky barrier principle in a large area metaltosilicon power diode. stateoftheart geometry features epitaxial construction with oxide passivation and metal overlap contact. ideally suited for use as rectifiers in lowvoltage, highfrequency inverters, free wheeling diodes, and polarity protection diodes. ? extremely low v f ? low power loss/high efficiency ? highly stable oxide passivated junction ? low stored charge, majority carrier conduction mechanical characteristics: ? case: epoxy, molded ? weight: 0.4 gram (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 220 c max. for 10 seconds, 1/16 from case ? shipped in plastic bags, 1000 per bag ? available tape and reeled, 5000 per reel, by adding a arl'' suffix to the part number ? polarity: cathode indicated by polarity band ? esd ratings: machine model = a human body model = 2 ? marking: mbr3060 maximum ratings rating symbol max unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 60 v average rectified forward current t l = 125 c (r jl = 13 c/w, p.c. board mounting) i o 3.0 a nonrepetitive peak surge current i fsm 125 a operating and storage junction temperature range (reverse voltage applied) t j , t stg 65 to +150 c peak operating junction temperature (forward current applied) t j(pk) 150 c device package shipping ordering information http://onsemi.com axial lead case 5909 plastic schottky barrier rectifier 3.0 amperes 60 volts mbr3060 axial lead 1000 units/bag mbr3060rl axial lead 5000/tape & reel marking diagram mbr3060 mbr3060 = device code
mbr3060 http://onsemi.com 2 thermal characteristics characteristic symbol max unit thermal resistance, junctiontolead (note 1, see note 3, mounting method 3) r q jl 13 c/w thermal resistance, junctiontoambient (see note 3, mounting method 3) r q ja 50 c/w electrical characteristics (t l = 25 c unless otherwise noted) (note 1) characteristic symbol max unit maximum instantaneous forward voltage (note 2) (i f = 3.0 amp), t l = 25 c (i f = 3.0 amp), t l = 100 c v f 0.62 0.59 v maximum instantaneous reverse current (note 2) (v r = 60 v), t l = 25 c (v r = 60 v), t l = 100 c i r 150 10 a ma 1. lead temperature reference is cathode lead at printed wiring board. 2. pulse test: pulse width = 300 m s, duty cycle = 2.0%. typical characteristics 0.10 1.00 10.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 100 c 150 c 25 c 75 c figure 1. typical forward voltage v f , instantaneous voltage (volts) i f , forward current (amps) 0.10 1.00 10.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 100 c 150 c 25 c 75 c figure 2. maximum forward voltage v f , instantaneous voltage (volts) i f , forward current (amps) 0.0001 0.001 0.01 0.1 1.0 10 100 0 102030405060 v r , reverse voltage (volts) i r , reverse current (ma) figure 3. typical reverse current 100 c 150 c 25 c 75 c 10 100 1000 0102030405060 25 c figure 4. typical capacitance v r , reverse voltage (volts) c, capacitance (pf) f = 1 mhz
mbr3060 http://onsemi.com 3 typical characteristics 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 25 45 65 85 105 125 165 t i , lead temperature (c ) i fo average forward current (amps) 145 4.0 4.5 5.0 0 0.5 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 20 40 60 80 100 120 140 160 rated v r r ja = 50 c/w t j = 150 dc t a , ambient temperature (c ) i f , average forward current (amps) sq. wave 1.0 figure 5. current derating ambient dc sq. wave figure 6. current derating lead 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 1.0 2.0 3.0 4.0 5.0 6.0 i o , average forward current (amps) p fo , average power dissipation (watts) figure 7. forward power dissipation rated v r r jl = 13 c/w t j = 150
mbr3060 http://onsemi.com 4 typical values for r q jl in still air data shown for thermal resistance junctiontoambient (r q ja ) and thermal resistance junctiontolead (r q jl ) for the mountings shown is to be used as typical guideline values for preliminary engineering, or in case the tie point temperature cannot be measured. 1 2 3 mounting method lead length, l (in) 1/8 1/4 1/2 r q ja 15 23 37 c/w c/w c/w 30 38 52 13 note 3 e mounting data mounting method 1 p.c. board with 11/2 x 11/2 copper surface. l l l mounting method 2 vector pushin terminals t28 l mounting method 3 p.c. board with 11/2 x 11/2 copper surface. l = 1/2'' board ground plane typical values for r q ja in still air 1 2 3 mounting method lead length, l (in) 1/8 1/4 1/2 3/4 r q ja 52 65 72 85 c/w c/w c/w 67 80 87 100 50
mbr3060 http://onsemi.com 5 package dimensions axial lead case 5909 issue r k a d k b dim min max min max millimeters inches a 5.80 7.60 0.228 0.299 b 2.60 3.60 0.102 0.142 d 0.71 0.86 0.028 0.034 k 25.44 --- 1.000 --- notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 59-04 obsolete, new standard 59-09. 4. 59-03 obsolete, new standard 59-10. 5. all rules and notes associated with jedec do-41 outline shall apply. 6. polarity denoted by cathode band. 7. lead diameter not controlled within f dimension.
mbr3060 http://onsemi.com 6 notes
mbr3060 http://onsemi.com 7 notes
mbr3060 http://onsemi.com 8 on semiconductor and are trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scill c data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthori zed use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. publication ordering information japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. mbr3060/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com n. american technical support : 8002829855 toll free usa/canada
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